Designation :Deputy Director & Associate Professor (Sr.)
Ph.D : IIT Madras (2007)
Postdoc : University of Glasgow, U.K. & Technical University Vienna (2007-2009)
Contact Details : bindu.boby@vit.ac.in, +91-44-3993-1464
Research Area :
- Nano-scaled Devices and Circuits
- Semiconductor Device Modelling
- Analog IC Design
Employee ID | 50729 | ||||
Intercom | 1464 | ||||
Educational details (Please mention all the degrees with latest first) | |||||
Degree | Passed out year | Specialization | Institute/University/ College | ||
PhD | 2007 | Microelectronics | Indian Institute of Technology Madras | ||
M.Tech | 2003 | Digital Electronics | Cochin University of Science and Technology, Cochin, Kerala | ||
B.E./B.Tech | 2001 | Electronics and Communication Engineering | Institution of Engineers (India) | ||
Post-Doctoral Experience if any | Postdoctoral Researcher, University of Glasgow, United Kingdom Postdoctoral Researcher, Technical University Graz, Austria Postdoctoral Researcher, Technical University Vienna, Austria | ||||
Research Details | |||||
Areas of Specialization | Nanoelectronics | ||||
ORCID ID | https://orcid.org/my-orcid?orcid=0000-0002-9274-6883 | ||||
Scopus ID | https://www.scopus.com/authid/detail.uri?authorId=13907959500 | ||||
H-index (scopus) | 9 | ||||
Google Scholar ID | Provide the link not just the ID – It should direct to your Google Scholar page | ||||
i10 index | 9 | ||||
Completed Funded Project Details | |||||
Completed Funded Project Title | Funding Agency | ||||
Development of a SPICE-Compatible Model for Single Event Transients for Circuit Simulations and its Application in SET-Tolerant DLL Design (Rs. 44.74 lakhs), 2016 – 2019 | DST-SERB | ||||
Development of a Modelling Framework for Variability-Aware Design of Strained FinFET based Mixed Signal Circuits (Rs. 21.94 lakhs), 2016 – 2019 | DST-SERB | ||||
Patent Published Details | |||||
Patent Published Title | Patent Published Application No. | ||||
A fast transient capacitor-less FVF low drop-out regulator with active feed forward compensation | 202041036036, published on 21/8/2020. | ||||
Major International Collaboration Details – Academic Collaboration Details | |||||
Type of collaboration (Research & publication/Funded Project/consultancy etc.), collaborating institute, year of collaboration | |||||
Device Modelling Group, University of Glasgow, United Kingdom (Research & publication), 2021 | |||||
System-on-Chip Research Center, Universiti Putra Malaysia (Research & publication), 2021 |