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Designation :Deputy Director & Associate Professor (Sr.)

Ph.D : IIT Madras (2007)

Postdoc : University of Glasgow, U.K. & Technical University Vienna (2007-2009)

Contact Details : bindu.boby@vit.ac.in, +91-44-3993-1464

Research Area :

  • Nano-scaled Devices and Circuits
  • Semiconductor Device Modelling
  • Analog IC Design
Employee ID50729
Intercom1464
Educational details (Please mention all the degrees with latest first)
DegreePassed out yearSpecializationInstitute/University/ College
PhD2007MicroelectronicsIndian Institute of Technology Madras
M.Tech2003Digital ElectronicsCochin University of Science and Technology, Cochin, Kerala
B.E./B.Tech2001Electronics and Communication EngineeringInstitution of Engineers (India)
Post-Doctoral Experience if anyPostdoctoral Researcher, University of Glasgow, United

Kingdom

Postdoctoral Researcher, Technical University Graz, Austria

Postdoctoral Researcher, Technical University Vienna, Austria

Research Details
Areas of SpecializationNanoelectronics
ORCID IDhttps://orcid.org/my-orcid?orcid=0000-0002-9274-6883
Scopus IDhttps://www.scopus.com/authid/detail.uri?authorId=13907959500
H-index (scopus)9
Google Scholar IDProvide the link not just the ID – It should direct to your Google Scholar page
i10 index9
Completed Funded Project Details
Completed Funded Project TitleFunding Agency
Development of a SPICE-Compatible Model for Single Event Transients for Circuit Simulations and its Application in SET-Tolerant DLL Design (Rs. 44.74 lakhs), 2016 – 2019DST-SERB
Development of a Modelling Framework for Variability-Aware Design of Strained FinFET based Mixed Signal Circuits (Rs. 21.94 lakhs), 2016 – 2019DST-SERB
Patent Published Details
Patent Published TitlePatent Published Application No.
A fast transient capacitor-less FVF low drop-out regulator with active feed forward compensation202041036036, published on 21/8/2020.
Major International Collaboration Details  – Academic Collaboration Details
Type of collaboration (Research & publication/Funded Project/consultancy etc.), collaborating institute, year of collaboration
Device Modelling Group, University of Glasgow, United Kingdom (Research & publication), 2021
System-on-Chip Research Center, Universiti Putra Malaysia (Research & publication), 2021

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